High-Performance Cu-Plating for Heterojunction Silicon Cells, Based on Ultra-Low-Cost Printed Circuit Board (PCB) Technology (Stage II)
Developing next-generation manufacturing toolset and process workflow for low-cost, high-performance copper patterning on S-PV cells
Sunpreme, Inc.
Recipient
Santa Clara, CA
Recipient Location
10th
Senate District
26th
Assembly District
$1,901,205
Amount Spent
Completed
Project Status
Project Result
This project was completed in 2019. The research team developed and tested next generation manufacturing at a pilot scale for copper patterning on silicon photovoltaic cells. This includes the following steps: dual-sided exposure for high-throughput wafer patterning, cell development, cell stripping, cell etching and lamination. The project team manufactured solar photovoltaic cells with 24.03% efficiency, performed in-house reliability testing, and received certification from an independent laboratory. Completion of the final project task of integrating the process into a large-scale PV cell factory was inhibited by a lack of additional investment.
The Issue
Standard front side metallization of industrial silicon solar cells uses silver paste for contact formation. Silver metal contained in the paste is an important cost driver in the manufacturing process. At the same time, the conductivity of printed and fired silver metallization is limited due to glass compounds and a porous structure. A metallization scheme based on all-copper plating proposed under this agreement has the potential to lower these costs while improving the overall efficiency of the photovoltaic cells.
Project Innovation
This project develops a next generation manufacturing tool for low-cost, high-performance copper patterning on solar photovoltaic cells using technologies from printed circuit board manufacturing, reducing costs by up to 35%, and increasing cell efficiency by 15%.
Project Benefits
The project is developing a next generation manufacturing tool for low-cost, high-performance copper patterning on solar photovoltaic cells using technologies from printed circuit board manufacturing. This new process will lower electricity-related greenhouse gas (GHG) emissions and improve solar cell efficiency.
Affordability
If successful, the production tools and processes developed under this agreement will allow for the manufacture of heterojunction silicon cells at 24% efficiency and 400 W panels at a cost of 40¢ per watt.
Environmental Sustainability
Lower costs for photovoltaic panels will support California's transition to renewable sources of energy and result in reduced greenhouse gas emissions.
Key Project Members
